| Series |
8077 |
| No. of Positions |
D Type 220P
(receptacle:176P)
E Type 250P
(receptacle:200P) |
| Pitch |
2.0mm |
| Rated Current |
AC/DC 0.75A |
| Rated Voltage |
AC/DC 250V |
| Withstanding Voltage |
AC 750Vrms/min. |
|
|
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 |
 Outline |
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Series 8077 is the additional version to series 8071.8072.8073.8074 and 8075 of 2.0mm hard metric multi-line module connector which have been developed based on the requirement of electric transmission system etc., for high speed and EMI control.
This connector is a 8+2 rows type optimized for high-density high pin count and is designed following same with multi-line module connector.
It is offered in two types, D type with coding key and E type without coding key. |
| Features |
|
| (1) |
Contact Material: Copper Alloy |
| (2) |
Insulator Material: Thermo plastic |
| (3) |
Operating Temperature Range: -55 to +125°C |
| (4) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
RoHS Compliance |
| 515+ |
Au(0.1µm Min.),Pd-Ni |
Au(0.05µm Min.) |
Yes |
| 515 |
Au(0.1µm Min.),Pd-Ni |
Au(0.05µm Min.) |
Yes |
| 517+ |
Au(0.76µm Min.) |
Au(0.05µm Min.) |
Yes |
| 517 |
Au(0.76µm Min.) |
Au(0.05µm Min.) |
Yes |
| 518+ |
Au(0.1µm Min.)
|
Au(0.05µm Min.) |
Yes |
| 518 |
Au(0.1µm Min.)
|
Au(0.05µm Min.) |
Yes |
| 519+ |
Au(0.38µm Min.)
|
Au(0.05µm Min.) |
Yes |
| 519 |
Au(0.38µm Min.)
|
Au(0.05µm Min.) |
Yes |
| 833+ |
Au(0.1µm Min.),Pd-Ni |
Sn |
Yes |
| 833 |
Au(0.1µm Min.),Pd-Ni |
Sn-Pb |
No |
| 840+ |
Au(0.38µm Min.)
|
Sn/Sn-Cu |
Yes |
| 840 |
Au(0.38µm Min.)
|
Sn-Pb |
No |
| 862+ |
Au(0.1µm Min.)
|
Sn/Sn-Cu |
Yes |
| 862 |
Au(0.1µm Min.)
|
Sn-Pb |
No |
| 863+ |
Au(0.76µm Min.)
|
Sn/Sn-Cu |
Yes |
| 863 |
Au(0.76µm Min.)
|
Sn-Pb |
No |
|
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| Related link |
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