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5087/5046/5047 Series

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		KYOCERA Corporation

Products > Product Type > Board to Board Connectors > 5087/5046/5047 Series

Japanese

5087/5046/5047 Series

0.5mmPitch Vertical-Vertical SMT With or Without metal tab Type

Series	5087/5046/5047
No. of Positions	5087 10 to 140 5046 20 to 120 5047 20 to 100
Stacking Height	5087=2,2.5,3,3.5,4mm 5046=3,3.5,4,4.5mm 5047=5,7mm
Pitch	0.5mm
Rated Current	AC/DC 0.4A
Rated Voltage	AC/DC 50V
Withstanding Voltage	AC 500Vrms/min.

Outline

Series 5046/5047/5087 are the Super Microleaf connector series, board to board, fine pitch and low-profile connector system that meets the need for high-density circuits in the market, and it is designed especially for the portable equipment. The stack height between boards can range from 2.0mm to 7.0mm. ELCO's original design concept of receptacle contact achieves fine click feeling at mating and extremely high reliability in the connection of these super micro sized connectors.
Designed for automatic mounting machine, packaged in tape and reel.

Features

(1)	Contact Material: Copper Alloy
(2)	Insulator Material: Heat resistance plastic
(3)	Operating Temperature Range: -25 to +85°C
(4)	Plating Specifications

Series 5087

Plating Code	Contact Area	Tail Area	Metal tab	RoHS Compliance
829+	Au(0.1µm Min.)	Au(0.05µm Min.)	Sn-Cu	Yes
829+	Au(0.1µm Min.)	Au(0.05µm Min.)	-	Yes
829	Au(0.1µm Min.)	Au(0.05µm Min.)	Sn-Pb	No
829	Au(0.1µm Min.)	Au(0.05µm Min.)	-	Yes
861+	Au(0.38µm Min.)	Au(0.05µm Min.)	-	Yes
861	Au(0.38µm Min.)	Au(0.05µm Min.)	-	Yes

Series 5046

Plating Code	Contact Area	Tail Area	Metal tab	RoHS Condition
829+	Au(0.1µm Min.)	Rece:Au(0.03µm Min.) Plug:Au(0.05µm Min.)	Sn-Cu	Yes
829+	Au(0.1µm Min.)	Rece:Au(0.03µm Min.) Plug:Au(0.05µm Min.)	-	Yes
829	Au(0.1µm Min.)	Rece:Au(0.03µm Min.) Plug:Au(0.05µm Min.)	Sn-Pb	No
829	Au(0.1µm Min.)	Rece:Au(0.03µm Min.) Plug:Au(0.05µm Min.)	-	Yes
868+	Au(0.1 to 0.3µm)	Rece:Au(0.05 to 0.1µm) Plug:Au(0.03 to 0.1µm)	Sn-Cu	Yes

Series 5047

Plating Code	Contact Area	Tail Area	Metal tab	RoHS Condition
829+	Au(0.1 to 0.2µm)	Au(0.03 to 0.1µm)	-	Yes
856+	Au(0.1µm Min.)	Sn-Cu	Sn-Cu	Yes
			-	Yes
856	Au(0.1µm Min.)	Sn-Pb	Sn-Pb	No
			-	No
861+	Au(0.2µm Min.)	Sn-Cu	Sn-Cu	Yes
			-	Yes
861	Au(0.2µm Min.)	Sn-Pb	Sn-Pb	No
			-	No