| Series |
5061/5072 |
| No. of Positions |
20,30,40,50,60,68,80
100,120,140,160,180,200 |
| Stacking Height |
12,12.5,13,14,15,16
17,18,19,20,22,24mm |
| Pitch |
1.27mm |
| Rated Current |
AC/DC 0.5A |
| Rated Voltage |
AC/DC 250V |
| Withstanding Voltage |
AC 650Vrms/min. |
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 Outline |
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The Microleaf connector is 1.27mm spacing two-piece board to board connector.
The leaf style design provides two points of contact with a positive snap-action and an audible click when fully engaged. The plugs of the 5072 series are compatible with a receptacle of the 5061 series. Owing to the development of new contacts, the insertion force required for mating has been decreased by approximately by 10% in comparison with the conventional 5061 plugs, and as many as 200 contacts have been achieved. This makes a long mating length and sequential contacts possible. |
| Features |
|
| (1) |
Contact Material: Copper Alloy |
| (2) |
Insulator Material: Heat resistance plastic |
| (3) |
Operating Temperature Range: -55 to +85°C |
| (4) |
Plating Specifications |
Series 5061
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 828+ |
Au(0.38µm Min.) |
Sn-Cu |
- |
Yes |
| 828 |
Au(0.38µm Min.) |
Sn-Pb |
Sn-Pb |
No |
| - |
No |
| 833+ |
Au(0.05µm Min.),Pd-Ni |
Sn-Cu |
- |
Yes |
| 833 |
Au(0.05µm Min.),Pd-Ni |
Sn-Pb |
- |
No |
| 856+ |
Au(0.1µm Min.) |
Sn-Cu |
Sn-Cu |
Yes |
| - |
Yes |
| 856 |
Au(0.1µm Min.) |
Sn-Pb |
Sn-Pb |
No |
| - |
No |
| 861+ |
Au(0.25µm Min.) |
Sn-Cu |
- |
Yes |
| 861 |
Au(0.25µm Min.) |
Sn-Pb |
- |
No |
| 863+ |
Au(0.76µm Min.) |
Sn-Cu |
- |
Yes |
| 863 |
Au(0.76µm Min.) |
Sn-Pb |
- |
No |
| 871+ |
Au(0.5µm Min.) |
Sn-Cu |
- |
Yes |
| 871 |
Au(0.5µm Min.) |
Sn-Pb |
- |
No |
|
Series 5072
| Plating Code |
Contact Area |
Tail Area |
RoHS Condition |
| 833+ |
Au(0.05µm Min.),Pd-Ni |
Sn-Cu |
Yes |
| 833 |
Au(0.05µm Min.),Pd-Ni |
Sn-Pb |
No |
| 856+ |
Au(0.1µm Min.) |
Sn-Cu |
Yes |
| 856 |
Au(0.1µm Min.) |
Sn-Pb |
No |
| 861+ |
Au(0.25µm Min.) |
Sn-Cu |
Yes |
| 861 |
Au(0.25µm Min.) |
Sn-Pb |
No |
| 863+ |
Au(0.76µm Min.) |
Sn-Cu |
Yes |
| 863 |
Au(0.76µm Min.) |
Sn-Pb |
No |
| 871+ |
Au(0.5µm Min.) |
Sn-Cu |
Yes |
| 871 |
Au(0.5µm Min.) |
Sn-Pb |
No |
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| Related link |
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