| Series |
5602 |
| No. of Positions |
16 to 80 |
| Stacking Height |
1.5,1.7,2.0,2.8mm |
| Pitch |
0.4mm |
| Rated Current |
AC/DC 0.5A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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Series 5602 is 0.4mm pitch board to board connector with stacking height of 1.5mm. It is designed to meet the requirements of miniaturization in the market of portable equipment.
It applies to the cellular phone, mobile PC, slim Notebook-PC, DSC (Digital Still Camera), DVC (Digital Video Camera) and other complex equipments markets. |
| Features |
|
| (1) |
0.4mm fine pitch and low profile connector with a stacking height of 1.5mm, achieving one of the smallest spaces available in the industry. |
| (2) |
Structured to prevent the detachment of plug and receptacle after their mating, resulting in the good click feeling as with all small pitch board to board designs. |
| (3) |
Offered with and without metal retention tabs and positioning bosses. |
| (4) |
Designed to prevent solder wicking. |
| (5) |
The small dead space on the back side of connector makes it possible to form the wiring patterns between the opposed product terminal lands, which is advantageous for high density mounting. |
| (6) |
Structured to also mount on FPC cables. |
| (7) |
Environmentally-friendly lead free type available. |
| (8) |
Contact Material: Copper Alloy |
| (9) |
Insulator Material: Heat resisting resin |
| (10) |
Operating Temperature Range: -25 to +85°C |
| (11) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 829+ |
Au(0.2µm Min.)
|
Au(0.05µm Min.) |
Sn-Cu |
Yes |
| - |
Yes |
| 829 |
Rece:Au(0.1 to 0.3µm)
Plug:Au(0.1 to 0.2µm) |
Rece:Au(0.05µm Min.)
Plug:Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
| - |
Yes |
| 831+ |
Au(0.05µm Min.),Pd-Ni |
Au(0.05µm Min.) |
Sn-Cu |
Yes |
| 831 |
Au(0.05µm Min.),Pd-Ni |
Au(0.05µm Min.) |
Sn-Cu |
Yes |
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| Related link |
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Japanese
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