| Series |
5603 |
| No. of Positions |
140 |
| Stacking Height |
10mm |
| Pitch |
0.5mm |
| Rated Current |
AC/DC 0.4A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 150Vrms/min. |
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 Outline |
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| Series 5603 is developed for expansion bus standardized in the T-Engine forum. It is 0.5mm pitch, Vertical, SMT type, board to board connector that contains 140 contacts. It is suited for ubiquitous equipment such as PDA. |
| Features |
|
| (1) |
Mating keys that have hundreds of combinations are integrally molded with the housing to prevent improper mating. The key code will be assigned by T-Engine forum. |
| (2) |
The bellows spring is equipped for the spring structure of the contacts, which obtains larger movable space, secures stable contact reliability, and possesses high reliability. |
| (3) |
Contact Material: Copper Alloy |
| (4) |
Insulator Material: Heat resisting resin |
| (5) |
Operating Temperature Range: -25 to +85°C |
| (6) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 861+ |
Au(0.2µm Min.)
|
Sn-Cu |
Sn-Cu |
Yes |
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| Related link |
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Japanese
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