| Series |
5604 |
| No. of Positions |
50 to 140 |
| Stacking Height |
1.5mm,2.0mm,2.4mm |
| Pitch |
0.5mm |
| Rated Current |
AC/DC 0.5A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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Series 5604 is SMT type, board to board connector with 0.5mm pitch that was designed for compact equipment such as cellular phones that need the high density package accompanying the tendency of downsizing and light-weighting in products in the market.
Multiple contacts from 60 to 120 are available.
While it achieves very low profile, it assures stable mated condition and improves the clicking feeling, which can ensure the proper mating action work. |
| Features |
|
| (1) |
Contact Material: Copper Alloy |
| (2) |
Insulator Material: Heat resistance plastic |
| (3) |
Operating Temperature Range: -25 to +85°C |
| (4) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 829+ |
Rece:Au(0.1 to 0.3µm)
Plug:Au(0.1 to 0.2µm) |
Rece:Au(0.03 to 0.1µm)
Plug:Au(0.05µm Min.) |
Sn-Cu |
Yes |
| - |
Yes |
| 829 |
Rece:Au(0.1 to 0.3µm)
Plug:Au(0.1 to 0.2µm) |
Rece:Au(0.03 to 0.1µm)
Plug:Au(0.05µm Min.) |
Sn-Cu |
Yes |
| - |
Yes |
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| Related link |
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Japanese
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