| Series |
5605 |
| No. of Positions |
16 to 80 |
| Stacking Height |
1.0mm |
| Pitch |
0.4mm |
| Rated Current |
AC/DC 0.4A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| This is a board to board connector with 0.4mm pitch and 1.0mm stacking height, and was developed based on the request for downsizing of cellular phones, PHS, and digital AV apparatus in the market. |
| Features |
|
| (1) |
The bellows spring, for which rolled plane of the spring material is used, is employed to obtain high contact reliability. |
| (2) |
With dimples on the plug side, a nice clicking sound is obtained when the connectors are mated, preventing incomplete mating. |
| (3) |
The long wipe characteristic is achieved by using R-shaped contacts on the receptacle to maintain the contact reliability. |
| (4) |
Solder wicking is prevented by insert molding the plug and bottom wall (box-shaped) of the receptacle. There are plug contacts on the inside wall, which effectively protects against flux splash. |
| (5) |
The dead space behind the connector is small enough, and able to lay a wiring pattern between the pin lands of the connectors. |
| (6) |
It is offered with or without metal tabs and positioning boss. |
| (7) |
Contact Material: Copper Alloy |
| (8) |
Insulator Material: Heat resistance plastic |
| (9) |
Operating Temperature Range: -40 to +85°C |
| (10) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 829+ |
Rece:Au(0.1 to 0.3µm)
Plug:Au(0.1 to 0.2µm)
|
Rece:Au(0.03 to 0.1µm)
Plug:Au(0.05µm Min.) |
Sn-Cu |
Yes |
| - |
Yes |
| 829 |
Rece:Au(0.1 to 0.3µm)
Plug:Au(0.1 to 0.2µm)
|
Rece:Au(0.03 to 0.1µm)
Plug:Au(0.05µm Min.) |
Sn-Cu |
Yes |
| - |
Yes |
| 831+ |
Au(0.05µm Min.),Pd-Ni
|
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
| (11) |
This series maybe obsolete in future, please use Series 5805 connector alternatively for your new adoption. (22.May.2008) |
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| Related link |
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Japanese
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