| Series |
5609 |
| No. of Positions |
30 |
| Stacking Height |
3.0,4.2,5.0,7.0mm |
| Pitch |
0.8mm |
| Rated Current |
AC/DC 0.5A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 100Vrms/min. |
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 Outline |
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| Series 5609 is board to board connector with 0.8mm pitch, H=3.0mm, 4.2mm, 5.0mm, 7.0mm, and was designed for connection of MDC (Module Daughter Cards) used in Notebook-PC. |
| Features |
|
| (1) |
Plug contact is guided into the groove of receptacle contact, which improve mating function, also prevents displacement in the mounting process. |
| (2) |
Tuning-folk-shaped spring is equipped for the spring structure of the contacts to obtain high contact reliability by achieving stable contact-ability with the wider movable range. |
| (3) |
Solder cracks caused by vibration and/or dropping impact, is prevented by its original tail shape of contacts. |
| (4) |
Contact Material: Copper Alloy |
| (5) |
Insulator Material: Heat resistance plastic |
| (6) |
Operating Temperature Range: -30 to +105°C |
| (7) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| 800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
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| Related link |
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Japanese
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