| Series |
5645 |
| No. of Positions |
20 to 80 |
| Stacking Height |
1.5mm |
| Pitch |
0.5mm |
| Rated Current |
AC/DC 0.5A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| Series 5645 is 0.5mm pitch, 1.5mm stack height, low profile, board to board connector. It is designed for high density mounting, especially in slim Notebook-PC where the need for low profile solutions is critical. |
| Features |
|
| (1) |
Pitch is 0.5mm. Stacking height is a low profile 1.5mm design. These features give it an advantage on compact board designs. |
| (2) |
Even with the low profile and super compact design, exact mating and high reliability are still excellently maintained. |
| (3) |
This product has a metal retention tab for support, which improves board peeling strength during soldering. |
| (4) |
This product can withstand twisting when mating, and provides protection against soldering wicking. |
| (5) |
Contact Material: Copper Alloy |
| (6) |
Insulator Material: Heat resistance plastic |
| (7) |
Operating Temperature Range: -25 to +85°C |
| (8) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 829+ |
Au(0.1 to 0.2µm)
|
Au(0.05µm Min.) |
Sn-Cu |
Yes |
| 829 |
Au(0.1 to 0.2µm) |
Au(0.05µm Min.) |
Sn-Pb |
No |
|
| (9) |
This series maybe obsolete in future, please consult sales representative in your region before adoption. (16.Nov.2007) |
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| Related link |
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Japanese
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