| Series |
5801 |
| No. of Positions |
10 to 80 |
| Stacking Height |
0.8mm |
| Pitch |
0.4mm |
| Rated Current |
AC/DC 0.3A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| Series 5801 is a 0.4mm pitch board to board connector with 0.8mm of the lowest profile designed to meet the market requirement for downsizing and thinner tendency in cellular phones, PHS, and Digital AV apparatus. |
| Features |
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| (1) |
KEC-unique S-shaped spring is adopted for the spring structure, which realizes the lowest profile of 0.8mm in this field. |
| (2) |
"Double-sided contact structure" is adopted to enhance the resistance to vibration or drop shock. The "Twin-rib" structure that is employed for the shape of contact on plug side, which eliminates foreign obstacles such as splash of the flux, chips of boards separation and so on, and ensures the high contact reliability. |
| (3) |
"Fine lock mechanism" is adopted for mating lock structure that realizes the firm clicking response and enhances the retention force when connectors unmated even with their low profile. |
| (4) |
The metal tab reinforces the locking strength and is utilized for electrical connection such as "Ground", "Power" line or so. |
| (5) |
The checker connector is also supplied to realize easy check on conductivity and short-circuit in connectors under mated condition. |
| (6) |
Pattern can be laid out between connector leads, which is suitable for high density package, because no metal is exposed on the bottom of connector, which generates the small dead space. |
| (7) |
Contact Material: Copper Alloy |
| (8) |
Insulator Material: Heat resistance plastic |
| (9) |
Operating Temperature Range: -40 to +85°C |
| (10) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 829+ |
Au(0.1 to 0.3µm) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
| - |
Yes |
| 831+ |
Au(0.03 to 0.1µm),
Pd-Ni |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
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| Related link |
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Japanese
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