| Series |
5802 |
| No. of Positions |
10 to 60 |
| Stacking Height |
0.8mm |
| Pitch |
0.4mm |
| Rated Current |
AC/DC 0.3A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| Series 5802 is a 0.4mm pitch, ultra low profile, and space-efficient, Board to Board connector that responds to a surge of downsizing and slimming requirements for cellular phones, PHS, Digital AV apparatus and etc. 0.8mm in stacking height and 3.2mm in width including tails are realized. |
| Features |
|
| (1) |
The most space-efficient type connector among industry that achieves 0.8mm in stacking height and 3.2mm in width. |
| (2) |
Because no part of pins were exposed owing to the bottom wall of the connector in spite of its slim and low profile, a pattern can be laid between lands of tail rows, which enables less limited pattern layouts on boards. |
| (3) |
The pinching structure, highly resistant to vibration and drop shock, is adopted in contacts and the original structure excluding splashed flux or foreign matters attached is adopted on contacting points in order to obtain high contacting reliability. |
| (4) |
"Fine locking mechanism" adopted for mating structure realizes the nice clicking response and firm retention force against unmating despite of the ultra low profile. |
| (5) |
Connectors with metal tabs and without boss are provided as a standard type, other variations are planned to be provide. |
| (6) |
A checker connector to be mated with a connector is also available to check electrical continuity or short circuit of the connector. |
| (7) |
Contact Material: Copper Alloy |
| (8) |
Insulator Material: Heat resistance plastic |
| (9) |
Operating Temperature Range: -40 to +85°C |
| (10) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 829+ |
Au(0.1 to 0.2µm) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
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| Related link |
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Japanese
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