| Series |
5805 |
| No. of Positions |
10 to 80 |
| Stacking Height |
1.0mm |
| Pitch |
0.4mm |
| Rated Current |
AC/DC 0.3A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| Series 5805 is a very low profile 0.4mm pitch, 1.0mm stacking height board to board connector designed to meet the market requirement for downsizing and thinner tendency in cellular phones, PHS, and Digital AV apparatus. |
| Features |
|
| (1) |
KEC-unique S-shaped spring is adopted for the spring structure, which realizes very low profile. |
| (2) |
Double-sided contact structure is adopted to enhance the resistance to vibration or drop shock. The Twin-rib structure that is employed for the shape of contact on plug side, which eliminates foreign obstacles such as splash of the flux, chips of boards separation and so on, and ensures the high contact reliability. |
| (3) |
Fine lock mechanism is adopted for mating lock structure that realizes the firm clicking response and enhances the retention force when connectors unmated even with their low profile. |
| (4) |
The checker connector is also supplied to realize easy check on conductivity and short-circuit in connectors under mated condition. |
| (5) |
Connectors with or without the boss are available. |
| (6) |
Pattern can be laid out between connector leads, which is suitable for high density package, because no metal is exposed on the bottom of connector, which generates the small dead space. |
| (7) |
Contact Material: Copper Alloy |
| (8) |
Insulator Material: Heat resistance plastic |
| (9) |
Operating Temperature Range: -40 to +85°C |
| (10) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
RoHS Compliance |
| 829+ |
Au(0.1 to 0.3µm)
|
Au(0.03 to 0.1 µm) |
Yes |
| 831+ |
Au(0.03 to 0.1µm),Pd-Ni
|
Au(0.03 to 0.1 µm) |
Yes |
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| Related link |
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Japanese
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