| Series |
5846 |
| No. of Positions |
20 to 80 |
| Stacking Height |
3.0mm |
| Pitch |
0.4mm |
| Rated Current |
AC/DC 0.4A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
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 Outline |
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| Series 5846 is a 0.4mm pitch Board to Board connector to meet the market requirement for high density package and downsizing tendency in laptop PCs, mobile devices, and etc. It achieves 3.0mm of the stacking height and 5.8mm in width including leads. |
| Features |
|
| (1) |
Since the bottom of the connector is covered with a plate and no contact is exposed, which assures the connector of being free from a short circuit caused with the printed wire on the board. |
| (2) |
The pinching structure, highly resistant to vibration and drop shock, is adopted in contacts and the original structure excluding splashed flux or foreign matters attached is adopted on contacting points in order to obtain high contacting reliability. |
| (3) |
"Pendulum spring structure" as well as "FINE-LOCK structure" is adopted to the mating system, which achieves the excellent
clicking feeling, low mating force and high retaining force. |
| (4) |
A checker connector to be mated with a connector is also available to check electrical continuity or short circuit of the connector. |
| (5) |
Contact Material: Copper Alloy |
| (6) |
Insulator Material: Heat resistance plastic |
| (7) |
Operating Temperature Range: -40 to +85°C |
| (8) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
RoHS Compliance |
| 829+ |
Au(0.1 to 0.3µm)
|
Au(0.03 to 0.15 µm) |
Yes |
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| Related link |
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Japanese
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