| Series |
8000 |
| No. of Positions |
2 |
| Pitch |
1.0mm |
| Rated Current |
AC/DC 1A |
| Rated Voltage |
AC/DC 30V |
| Withstanding Voltage |
AC 500Vrms/min. |
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 Outline |
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| Series 8000 is 1.0mm pitch, super small and low-profile of wire to board type connector, 2.79mm of mating height with two contacts to meet the market requirement for high density package especially designed for small type of mobile devices. |
| Features |
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| (1) |
It is realized that space saving by 27% in volume as compared with our conventional product (Series 8005). |
| (2) |
Insulator locking structure that is tolerant of dropping impact and vibration is adopted taking account of its mounting style, which assures it's mating with a firm clicking response. |
| (3) |
IDC plug connector enables a bundle of connection with non-strip wires. Crimping the wire of AWG#32 through the insulator attains secure connection and high reliability. |
| (4) |
This is an environment friendly lead free product. |
| (5) |
Contact Material: Copper Alloy |
| (6) |
Insulator Material: Heat resistance plastic |
| (7) |
Operating Temperature Range: -55 to +80°C |
| (8) |
Plating Specifications |
| Plating Code |
Contact Area |
Insulation Displacement Area |
RoHS Compliance |
Note |
| 829+ |
Au(0.1µm Min.) |
Au(0.05µm Min.) |
Yes |
Recommend |
| 829 |
Au(0.1µm Min.) |
Au(0.05µm Min.) |
Yes |
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| Related link |
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