| Series |
8040 |
| No. of Positions |
2 |
| Pitch |
1.0mm |
| Rated Current |
AC/DC 1A |
| Rated Voltage |
AC/DC 30V |
| Withstanding Voltage |
AC 500Vrms/min. |
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 Outline |
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| Series 8040 is a super small and low-profile wire to board type connector of 1.0mm-pitch, 1.4mm of mating height with two-contact to meet the market requirement for high density package especially designed for small type of mobile devices. |
| Features |
|
| (1) |
1.4mm height of the lowest profile in the field is achieved. Also approximately 38.5% of space saving in volume is realized as compared with our conventional product (Series 8000). |
| (2) |
"Double-sided contact structure" is adopted to enhance the resistance to vibration or drop shock, also to ensure the high contact reliability. AWG#32, a wire of the standard type, is applicable as ever. |
| (3) |
Insulator locking structure is adopted to ensure the tolerance of impact and vibration, which enables the firm clicking response and the assured retention force in mating even with its low profile. |
| (4) |
The KEC-unique tail shape is very effective in protecting the solder wicking. |
| (5) |
Contact Material: Copper Alloy |
| (6) |
Insulator Material: Heat resistance plastic |
| (7) |
Operating Temperature Range: -55 to +80°C |
| (8) |
Plating Specifications |
| Plating Code |
Contact Area |
Insulation Displacement Area |
RoHS Compliance |
Note |
| 829+ |
Au(0.1µm Min.) |
Au(0.05µm Min.) |
Yes |
Recommend |
| 829 |
Au(0.1µm Min.) |
Au(0.05µm Min.) |
Yes |
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| Related link |
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