| Series |
6232 |
| No. of Positions |
3 to 31 |
| Profile Height |
| RA |
3.0mm |
 |
|
| Vertical,PTH |
5.5mm |
|
|
| Vertical,SMT |
5.1mm |
|
| Contact Location |
| RA |
Top contact
Bottom contact |
|
|
| ST |
Single sided contact |
|
| Pitch |
1.0mm |
| Rated Current |
AC/DC 0.5A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 500Vrms/min. |
| Applicable FPC thickness |
0.3mm |
|
|
|
 |
 Outline |
|
| Series 6232 is 1.0mm pitch, LIF, cost advantage design. Available variation are SMT / Through Hole version. SMT version is Vertical, Right Angle, top contact, bottom contact. Through Hole version is Vertical, Right Angle, bottom contact only. The SMT version can be packed in tape and reel for automatic mounting. |
| Features |
|
| (1) |
Contact Material: Copper alloy |
| (2) |
Insulator Material: Heat resistance plastic |
| (3) |
Operating Temperature Range: -20 to +85°C |
| (4) |
Plating Specifications |
Thorough Hole Type
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 000+/800+ |
Sn |
Sn |
Sn-Cu |
Yes |
| - |
Yes |
| 000/800 |
Sn |
Sn |
Sn-Pb |
No |
| - |
Yes |
| 868+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
| - |
Yes |
|
SMT Type
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 000+/800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| - |
Yes |
| 000/800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
| - |
No |
| 868+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
| - |
Yes |
|
|
|
| Related link |
|
|
|
 |
Japanese
Top of page