| Series |
6210/6212/6260/6262 |
| No. of Positions |
5 to 40 |
| Profile Height |
2.0mm |
| Contact Location |
| 6210/6260 |
Bottom contact |
 |
 |
| 6212/6262 |
Top contact |
|
| Pitch |
0.5mm |
| Rated Current |
| 6210/6212 |
AC/DC 0.4A |
 |
 |
| 6260/6262 |
AC/DC 0.4A (AC/DC 5mA) |
|
| Rated Voltage |
AC/DC 50V
(AC/DC 15V) |
| Withstanding Voltage |
AC 200Vrms/min. |
| Applicable FPC thickness |
0.3mm |
|
|
 |
 |
( );C/Ag Type
Outline |
 |
Series 6210, 6260, 6212, 6262, are low profile SMT, ZIF, with a slider lock flexible cable into the connector and a total height of 2.0mm. Series 6210 and 6260 have a bottom contact, 6212 and 6262 have a top contact.
6260 and 6262 are C / Ag version and Gold-Plated. |
Features |
 |
| (1) |
Contact Material: Phosphor bronze |
| (2) |
Insulator Material: Heat resistance plastic |
| (3) |
Operating Temperature Range: -40 to +85°C
Operating Temperature Range: -10 to +60°C(6260/6262 C/Ag Type) |
| (4) |
Plating Specifications |
Series 6210
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| 800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
|
Series 6212
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| 800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
|
Series 6260
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| 829+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
| 851+ |
Au(0.76µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
| 851 |
Au(0.76µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Pb |
No |
| 868+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
| 883 |
Au(0.1µm Min.) |
Sn-Pb |
Sn-Pb |
No |
| 894+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
Series 6262
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
Note |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
|
| 829+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
|
| 846+ |
Au(0.1µm Min.) |
Au(0.08 to 0.2µm Min.) |
Sn-Cu |
Yes |
Recommend |
| 868+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
| 883 |
Au(0.1µm Min.) |
Sn-Pb |
Sn-Pb |
No |
|
| 894+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
|
|
 |


| Related link |
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