| Series |
6214/6274 |
| No. of Positions |
| 6214 |
6 to 30 |
 |
|
| 6274 |
31 to 50 |
|
| Profile Height |
| 6214 |
4.1mm |
|
|
| 6274 |
4.4mm |
|
| Contact Location |
Single sided contact |
| Pitch |
0.5mm |
| Rated Current |
AC/DC 0.4A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 200Vrms/min. |
| Applicable FPC thickness |
0.3mm |
|
|
|
 |
 Outline |
|
| Series 6214 and 6274 are 0.5mm pitch, Vertical, SMT, FFC / FPC, ZIF connectors with a Slid locking system. Total height is 4.1mm for series 6214 and 4.4mm for series 6274. |
| Features |
|
| (1) |
Contact Material: Phosphor bronze |
| (2) |
Insulator Material: Heat resistance plastic |
| (3) |
Operating Temperature Range: -40 to +85°C |
| (4) |
Plating Specifications |
Series 6214
| Plating Code |
Contact Area |
Tail Area |
Meta tab |
RoHS Compliance |
Note |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
|
| - |
Yes |
|
| 800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
|
| - |
No |
|
| 829+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
|
| 846+ |
Au(0.1µm Min.) |
Au(0.08 to 0.2µm Min.) |
Sn-Cu |
Yes |
Recommend |
| 868+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
| 883+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
|
| 883 |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Pb |
No |
|
| 894+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
| - |
Yes |
|
|
Series 6274
| Plating Code |
Contact Area |
Tail Area |
Meta tab |
RoHS Compliance |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| - |
Yes |
| 800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
| - |
No |
| 894+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
| - |
Yes |
|
|
|
| Related link |
|
|
|
 |
Japanese
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