| Series |
6281 |
| No. of Positions |
17 to 81 |
| Profile Height |
1.25mm |
| Contact Location |
Bottom contact |
| Pitch |
0.3mm |
| Rated Current |
AC/DC 2A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 200Vrms/min. |
| Applicable FPC thickness |
0.2mm |
|
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 |
 Outline |
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Series 6281 is bottom contact, ZIF, flip-top style connector with 0.3mm pitch and 1.25mm height designed to meet the market requirements of downsizing and high-density packaging. This connector can be used for a wide range of applications including DVD Drives, LCD Modules and Hand Held Devices.
Designed for automatic mounting machine, packed in tape and reel. |
| Features |
|
| (1) |
Flip-top style mechanism locks the flexible cable in place and gives a click feeling when closed. |
| (2) |
Equipped with metal strain relief tabs that prevent an FPC from being pulled vertically out of the connector. |
| (3) |
With staggered pin out, making tracking and inspection easier. |
| (4) |
In spite of the very low profile design, there is no prohibited area for tracking under the connector. |
| (5) |
Lead free and anti solder wicking |
| (6) |
Contact Material: Phosphor bronze |
| (7) |
Insulator Material: Heat resistance plastic |
| (8 |
Operating Temperature Range: -40 to +85°C |
| (9) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
Note |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
Recommend |
| 800 |
Sn-Pb |
Sn-Pb |
Sn-Pb |
No |
|
| 829+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
|
| 829 |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Pb |
No |
|
| 846+ |
Au(0.1µm Min.) |
Au(0.08 to 0.2µm Min.) |
Sn-Cu |
Yes |
Recommend |
| 868+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
| 868 |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Pb |
No |
|
| 894+ |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Cu |
Yes |
|
| 894 |
Au(0.05µm Min.) |
Au(0.03 to 0.1µm) |
Sn-Pb |
No |
|
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| Related link |
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Japanese
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