| Series |
6285 |
| No. of Positions |
17 to 81 |
| Profile Height |
1.1mm |
| Contact Location |
Bottom contact |
| Pitch |
0.3mm |
| Rated Current |
AC/DC 0.2A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
| Applicable FPC thickness |
0.15mm |
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 Outline |
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| Series 6285 is a 0.3mm pitch, ZIF, Right Angle, bottom contact, Flip-top style FPC connector. It has a height of 1.1mm designed to meet the requirement of the miniaturization of portable equipment in the market. It is also designed to utilize the progress of packaging technology, and the trend of narrower pitch, and the increasing pin count of the connector. This connector is generally used in Mobile PC, Slim Notebook-PC, Cellular Phone, PHS, DVC, DSC, MD, and complex machines in which several of these applications are incorporated. |
| Features |
|
| (1) |
Flip-top actuator incorporated to increase ease of use. |
| (2) |
Equipped with a fixing metal tab to meet the need for firm mounting. |
| (3) |
Guiding mechanism added at the FPC insertion slot increasing the upward retention force of FPC and also preventing mating misalignment in the side-to-side direction. |
| (4) |
Contact Material: Copper alloy |
| (5) |
Insulator Material: Heat resistance plastic |
| (6) |
Operating Temperature Range: -20 to +85°C |
| (7) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 800+ |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| 800 |
Sn-Cu |
Sn-Cu |
Sn-Cu |
Yes |
| 883+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
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| Related link |
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Japanese
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