| Series |
6295 |
| No. of Positions |
17 to 61 |
| Profile Height |
0.9mm |
| Contact Location |
Bottom contact |
| Pitch |
0.3mm |
| Rated Current |
AC/DC 0.2A |
| Rated Voltage |
AC/DC 50V |
| Withstanding Voltage |
AC 250Vrms/min. |
| Applicable FPC thickness |
0.15mm |
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 Outline |
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| Series 6295 is ultra low profile 0.3mm pitch, Right Angle, Flip-top style, SMT connector. With a total height of 0.9mm it is develop based on the request for downsizing and high density mounting of Cellular Phones and PDA's in the market. A reduction of 54% is achieve for the mounting space ratio, and the volume ratio is decrease by 45%. The Foot print was also reduced from existing products. |
| Features |
|
| (1) |
The metal support to give a strain relief when FPC is pulled vertically |
| (2) |
The staggered tails make the fillet inspection and repairing easier |
| (3) |
The connector has a fully insulated base |
| (4) |
Anti solder wicking and lead free |
| (5) |
Contact Material: Phosphor bronze |
| (6) |
Insulator Material: Heat resistance plastic |
| (7) |
Operating Temperature Range: -20 to +85°C |
| (8) |
Plating Specifications |
| Plating Code |
Contact Area |
Tail Area |
Metal tab |
RoHS Compliance |
| 846+ |
Au(0.1µm Min.) |
Au(0.08 to 0.2µm Min.) |
Sn-Cu |
Yes |
| 883+ |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
| 883 |
Au(0.1µm Min.) |
Au(0.03 to 0.15µm) |
Sn-Cu |
Yes |
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| Related link |
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Japanese
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